China's assets ETF and China Stock Exchange rose by nearly 5% when they were rich, China's assets ETF and China Stock Exchange rose by nearly 5% when they were rich, and China's ETF rose by nearly 5% when they were rich three times. China's overseas Internet ETF rose by nearly 2%; Bili Bili rose nearly 4%, Xpeng Motors rose nearly 3%, Pinduoduo and Baidu rose over 2%, and Ali and Weilai rose nearly 2%.Prime Minister of Thailand: The third phase of relief funds will be distributed next year.According to the analysis of the daily limit at noon on December 12, the Growth Enterprise Market index rose by 1.47% in half a day, and the big financial and consumer stocks collectively strengthened. Shandong Fiberglass and Rishang Group are connected with 7 boards, and one picture can be understood > >
The opposition party in South Korea said that Yin Xiyue was insane. On the morning of December 12, local time, South Korean President Yin Xiyue made another televised speech, refused to step down early, and denied that martial law was a crime of civil strife. After Yin Xiyue's speech, public opinion in South Korea immediately criticized him. South Korea's largest opposition party, the Common Democratic Party, said that Yin Xiyue was mentally ill and called on the South Korean National Assembly to pass the impeachment case. After Yin Xiyue's speech, Han Dongxun, the representative of the ruling party in South Korea, also said that Yin Xiyue's speech had no introspection and was rationalizing his behavior. Some commentators pointed out that Yin Xiyue may have expected that he could not prevent the National Assembly from passing the impeachment case and was trying to influence the final ruling of the Constitutional Court. I am afraid that the chaos in Korean politics will continue.The United States ITC issued a 337-part final ruling on electronic cigarette oil atomizers and their components and downstream products. According to China Trade Relief Information Network, on December 10th, the United States International Trade Commission (ITC) issued a notice saying that certain electronic cigarette oil atomizers and their components and downstream products (components thereof, And Products Containing the Same (investigation code: 337-TA-1392) made the final ruling of part 337: the preliminary ruling (No.32) made by the administrative judge in this case on November 8, 2024 was not reviewed, that is, the investigation of the following contents in this case was terminated based on the withdrawal of the applicant: U.S. registered patent No.11,369,757, paragraphs 2, 9 and 17. Complaints 23, 26 and 30 of U.S. Patent No.11,766,527 and complaints 11, 16-18 and 20 of U.S. Patent No.11,759,580.Korean Air passed the US antitrust review, clearing the way for completing the Asiana Airlines transaction.
Afternoon comments on Hong Kong stocks: Hang Seng Index rose by 1.72%, Hang Seng Technology Index rose by 2.55%, Hong Kong stocks closed at noon, Hang Seng Index rose by 1.72% and Hang Seng Technology Index rose by 2.55%. Chinese brokerage stocks and consumer stocks were among the top gainers, with China Merchants Securities, Mengniu Dairy and Tongcheng Travel up over 7% and over 5% respectively.Shanghai Headquarters of the Central Bank: The amount of cross-border RMB settlement in Shanghai in November was 2,491.8 billion yuan. According to the news of Shanghai Headquarters of the Central Bank, as of the end of November, there were 102 banks in Shanghai that submitted information on cross-border RMB settlement business, with a settlement amount of 2,491.8 billion yuan in November and a cumulative settlement amount of 27,151.9 billion yuan from January to November.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)
Strategy guide
12-14
Strategy guide
12-14
Strategy guide 12-14